发明名称 |
LEITERPLATTENANORDNUNG UND VERFAHREN ZU IHRER HERSTELLUNG |
摘要 |
Methods of manufacturing a printed board assembly. In one embodiment, a substrate is coated with an electrically conducting material; electrical components are mounted on some areas of the substrate; non-conducting material is disposed in areas between the electrical components; the substrate, electrical components and non-conducting material are sandwiched between two sheets of resin coated conducting foil, wherein the resin on the foils faces the substrate and buries the electrical components; circuit patterns are etched in the exposed surfaces of the resin coated conducting foils; and, electrical connections are established between at least one of the resin coated conducting foils and the electronic components. |
申请公布号 |
AT287198(T) |
申请公布日期 |
2005.01.15 |
申请号 |
AT19990956422T |
申请日期 |
1999.10.05 |
申请人 |
TELEFONAKTIEBOLAGET LM ERICSSON (PUBL) |
发明人 |
BERGSTEDT, LEIF;LIGANDER, PER;BOUSTEDT, KATARINA |
分类号 |
H05K1/18;H05K3/38;H05K3/46;(IPC1-7):H05K1/03;H05K1/16 |
主分类号 |
H05K1/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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