| 发明名称 |
PLASMA PROCESSING APPARATUS HAVING MESH FOR PROCESSING WIDE AREA OR RECTANGULAR SUBSTRATE WITH REACTIVE PLASMA |
| 摘要 |
PURPOSE: A plasma processing apparatus is provided to perform a plasma treatment on a wide area substrate or a rectangular substrate by using even a reactive plasma. CONSTITUTION: A plasma processing apparatus includes an electromagnetic wave emission window and a dielectric area. The electromagnetic wave emission window includes a waveguide tube(81), a waveguide tube antenna(82), and a dielectric material. The dielectric area is inserted between the waveguide tube antenna and the electromagnetic wave emission window. The electromagnetic wave emitted from the waveguide tube antenna through the dielectric area and the electromagnetic wave emission window generates plasma. A mesh made of a conductive material is implemented between the dielectric area and the electromagnetic wave emission window.
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| 申请公布号 |
KR20050006098(A) |
申请公布日期 |
2005.01.15 |
| 申请号 |
KR20040105456 |
申请日期 |
2004.12.14 |
| 申请人 |
KABUSHIKI KAISHA EKISHO SENTAN GIJUTSU KAIHATSU CENTER |
发明人 |
GOTO, MASASHI;NAKATA, YUKIHIKO |
| 分类号 |
C23C16/511;C23C16/00;C23F1/00;C23F4/00;H01J37/32;H01L21/205;H01L21/30;H01L21/302;H01L21/3065;H05H1/00;H05H1/30;H05H1/46;(IPC1-7):H05H1/30 |
主分类号 |
C23C16/511 |
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