| 摘要 |
PURPOSE: A slurry supply apparatus of CMP(Chemical Mechanical Polishing) equipment is provided to restrain scratches of a wafer due to large-sized slurry grains and to increase a filter replacing cycle by using predetermined two filters. CONSTITUTION: A slurry supply apparatus includes a pre-tank and a supply tank, a first supply line, a second supply line, a third supply line, an opening/closing valve, a first filter and a second filter. The pre-tank(21) and the supply tank(25) are used for storing and supplying slurry, respectively. The first supply line(22) is installed between the pre-tank and the supply tank. The second supply line(24) is used for transferring the slurry from the supply tank. The third supply line(29) is installed between the second supply line and CMP equipment(30). The opening/closing valve(27) is installed on the third supply line. The first filter(28a) for filtering firstly grains of the slurry is installed on the second supply line. The second filter(28b) for filtering secondly the slurry grains is installed on the third supply line. The second filter has relatively fine pores compared to the first filter.
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