发明名称 PARTS REMOVING DEVICE AND PARTS REMOVING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a parts removing device capable of easily removing parts mounted on a printed circuit board at a low cost. SOLUTION: The parts removing device has a gear box 15 pressing parts to be removed by pressing a pressing member 10 from the printed circuit board, a handle 17, and a supporting member 5 supporting the printed circuit board against pressing while accepting movement of the pressing member 10. A mounting area of the parts to be removed of the printed circuit board is broken by pressing, and the parts to be removed is separated from the printed circuit board with a part of the printed circuit board. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005007523(A) 申请公布日期 2005.01.13
申请号 JP20030174661 申请日期 2003.06.19
申请人 SONY CORP 发明人 NAKAMURA HIDEKAZU;HORI HISAYOSHI
分类号 B23D17/08;H05K3/00;(IPC1-7):B23D17/08 主分类号 B23D17/08
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