| 摘要 |
<P>PROBLEM TO BE SOLVED: To prevent a bonding wire from being cut by preventing the occurrence of cracks in mold resin. <P>SOLUTION: A semiconductor chip 8 is integrally joined to a die stage 2 of a lead frame 1 through a bonding agent 7. An electrode of the semiconductor chip 8 and a lead 5 of the lead frame 1 are electrically connected together through the bonding wire 6. Mold resin 9 encloses the semiconductor chip 8, the die stage 2, the bonding wire 6, and an inner-lead portion 5a of the lead 5, etc. The profile shape of the die stage 2 is constituted so as to fit to the inside of the profile shape of the semiconductor chip 8. Notches are provided on the periphery portion of the die stage 2, and the mold resin flows into the notches, so that the relative displacement of the die stage 2 to the mold resin is prevented when exfoliation occurs in a boundary region of the die stage 2 and the mold resin 9. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
