| 摘要 |
PROBLEM TO BE SOLVED: To reduce the cost of manufacturing a device by eliminating the necessity of the mechanism of adjusting the height position of a chip core in a simple structure in the video head device. SOLUTION: An adhesion surface 19 with a base member is formed at a height position coincident with the lower end of a gap 14 formed in a chip core 6. The adhesion surface 19 is bonded to the upper surface of the base member, and the base member is bonded to the bottom surface of a rotary cylinder. Thus the height positions of the chip cores 6 are made to match each other, and the necessity of a height adjusting mechanism is removed. COPYRIGHT: (C)2005,JPO&NCIPI
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