METHOD OF MANUFACTURING SEMICONDUCTOR THIN FILM AND SEMICONDUCTOR DEVICE

摘要

PROBLEM TO BE SOLVED: To obtain a good semiconductor film in a short time by accelerating the penetration of an etchant for peeling so as to improve the uniformity of an etching speed in a method of forming the semiconductor thin film on a substrate and thereafter peeling it.

SOLUTION: When a plurality of semiconductor films 20 are on the substrate 11, a connection supporter 40 connects the plurality of semiconductor films 20 with each other and supports them. As the connection supporter 40, there is used one provided with a gap for transmitting the etchant in a direction vertical to the surface of the substrate 11 or in a direction parallel to the surface.

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