| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing equipment and a method for processing a substrate, in which the thickness of the liquid film of treatment liquid formed on the surface of a substrate is measured correctly. SOLUTION: The substrate processing equipment has a spin chuck 1 which holds a substrate W nearly in a horizontal position and rotates. Above the spin chuck 1, a nozzle 2 for supplying sulfuric acid to the surface of the substrate W, a soft spray nozzle 3 for supplying a jet of droplets of oxygenated water to the surface of the substrate W, and a ultrasonic type distance measuring sensor 4 are movably set. Before a liquid film LF of the sulfuric acid is formed on the surface of the substrate W, a distance to the surface of the substrate W is measured, after the liquid film LF of the sulfuric acid is formed on the surface of the substrate W, a distance to the surface of the liquid film LF of the sulfuric acid on the substrate W is measured, and the thickness of the liquid film LF of the sulfuric acid is computed. COPYRIGHT: (C)2005,JPO&NCIPI
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