发明名称 |
Semiconductor device and method of manufacturing the same, cirucit board, and electronic instrument |
摘要 |
A method of manufacturing a semiconductor device including: mounting a semiconductor chip in which an integrated circuit is formed on a wiring board having an interconnecting pattern; mounting a board for electrical connection having a plurality of penetrating conductive sections on the wiring board; disposing a first end surface of each of the penetrating conductive sections to face the interconnecting pattern; electrically connecting the first end surface and the interconnecting pattern; and forming a sealing section which seals the semiconductor chip and the board for electrical connection such that a second end surface of each of the penetrating conductive sections is exposed from the sealing section.
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申请公布号 |
US2005009243(A1) |
申请公布日期 |
2005.01.13 |
申请号 |
US20040853288 |
申请日期 |
2004.05.26 |
申请人 |
SEIKO EPSON CORPORATION |
发明人 |
TANIGUCHI JUN |
分类号 |
H01L23/12;H01L21/00;H01L21/44;H01L21/50;H01L21/56;H01L21/58;H01L21/60;H01L21/98;H01L23/28;H01L23/48;H01L25/065;H01L25/10;H01L25/11;H01L25/18;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/12 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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