发明名称 |
Method for manufacturing micro electro-mechanical systems using solder balls |
摘要 |
A method for manufacturing micro electro-mechanical systems includes forming an insulation layer on an upper surface of a semiconductor substrate, forming a structure layer on an upper surface of the insulation layer and etching the structure layer, forming an under bump metal on a predetermined position of an upper surface of the structure layer, forming a via hole in a glass substrate corresponding to the position of the under bump metal and in a shape such that the via hole is larger in diameter at an upper surface of the glass substrate than at a lower surface of the glass substrate, wherein the glass substrate is bonded to the upper surface of the structure layer and creates a vacuum chamber that protects a structure of the structure layer, and arranging a solder ball in the via hole and bonding the solder ball to the under bump metal.
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申请公布号 |
US2005009315(A1) |
申请公布日期 |
2005.01.13 |
申请号 |
US20040784144 |
申请日期 |
2004.02.23 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KIM WOON-BAE;CHOA SUNG-HOON;CHOI MIN-SEOG |
分类号 |
B81C1/00;B81B3/00;B81B7/00;H01L21/00;H01L21/44;H01L21/4763;H01L21/60;H01L23/10;H01L23/12;(IPC1-7):H01L21/00;H01L21/476 |
主分类号 |
B81C1/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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