| 摘要 |
PROBLEM TO BE SOLVED: To provide a testpiece analyzing method and its equipment which samples (extracts) only a testpiece strip including a desired specific region from a semiconductor wafer or a device chip and mount it on the testpiece stage of analysis/measuring apparatus without taking a testpiece making-process executed by manual operation which requires experience, skill or time duration. SOLUTION: The analyzing method comprises the processes of: memorizing the coordinate information of desired location such as that of contamination or defect detected by inspection means on a testpiece substrate; extracting the testpiece strip including a substrate chip at the desired location from the testpiece substrate on the basis of the coordinate information of the desired location by utilizing focused ion beam processing; fixing the testpiece strip extracted by the process at a testpiece holder corresponding to at least one apparatus among those of analysis, observation and measurement; processing the testpiece strip fixed at the testpiece holder into a shape which is suitable for at least one application among those of analysis, observation and measurement; and analyzing the desired location in such a manner that the testpiece holder in which the testpiece strip is fixed is introduced into at least one apparatus among those of analysis, observation and measurement. COPYRIGHT: (C)2005,JPO&NCIPI
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