Manufacturing method of semiconductor device

摘要

The invention provides an algorithm for aligning a rotating blade in a dicing process of partially dicing a wafer attached to a substrate. A width of a cut groove and distance between pads in the cut groove are detected by a recognition camera. Based on a result of this detection, alignment data Deltay which is distance between a centerline of the width of the cut groove and a real centerline are calculated. Based on a difference between the distance of the pads in the cut groove and a target value of the distance, data Deltaz on alignment in a depth direction of the cut groove is calculated. The rotating blade is aligned by using the alignment data Deltay and Deltaz.