| 发明名称 |
METHOD FOR HEAT ABSORPTION USING POLYOXYMETHYLENE POLYMER COMPOSITIONS |
| 摘要 |
The present invention provides methods for heat absorption and thermally protected enclosures for containing heat sensitive devices, which include a heat absorption composition including polyoxymethylene polymer.
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| 申请公布号 |
US2005006621(A1) |
申请公布日期 |
2005.01.13 |
| 申请号 |
US20030408051 |
申请日期 |
2003.04.03 |
| 申请人 |
ALLIEDSIGNAL, INC. |
发明人 |
REN JANE;OSUCH CHRISTOPHER E.;OLZAK RICHARD A. |
| 分类号 |
C09K5/16;G11B33/14;H05K5/02;(IPC1-7):C09K3/18 |
主分类号 |
C09K5/16 |
| 代理机构 |
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