MODULE AND METHOD FOR FABRICATING THE SAME

摘要

A module which can be reduced in size while enhanced in reliability and productivity, and a method for fabricating the same. The module comprises a connector (6) having metal terminals for connection, and a circuit board (1) mounting electronic components, wherein the connector (6) and the circuit board (1) are connected through a metal lead (7). The connector (6) on the side being connected with the circuit board, the metal lead (7) and the electronic components are sealed with the same thermosetting resin (9) which is in solid state at a temperature of 40 ˚C or below before curing, and the thickness of the thermosetting resin (9) sealing the electronic component depends on the height of the electronic component.