| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a backing material and a substrate carrier in a polishing device, preventing a deviation at polishing regardless of kinds even when a substrate has a large diameter such as 10inches and 12inches, by increasing adhesion to the substrate of the carrier using a flexible film. <P>SOLUTION: In the carrier 4 in polishing device, the backing material to be brought into tight contact with the substrate of the carrier of the polishing device is made from a laminated element including a flexible rubber film base layer 19a, a foaming resin layer 19d, and a adhesive resin layer 19e that can hold the substrate on a surface, on an upper surface plate (a rigid body annular ring) 30. The carrier 4 is characterised in that an annular holding ring 22 made of a glass fiber-reinforced epoxy resin is provided on the outer peripheral edge of the adhesive resin layer 19e on a bottom surface of the backing material 19, a substrate storing pocket portion 25 is formed by an inside wall of the resinous annular holding ring and a bottom surface of the adhesive resin layer 19e, and the carrier 4 of the polishing device has a structure capable of pressurizing or decompressing from an upper surface side of the flexible rubber film. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
