| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat-treating apparatus capable of heat-treating a substrate both uniformly and quickly. SOLUTION: On the surface of a heat-treating plate 11, three balls 15 are arranged. The balls are arranged in a state in which the top end of the ball 15 protrude slightly from the surface of the heat-treating plate 11 and a substrate W is placed and supported on the balls 15 of the heat-treating plate 11 in a state in which a slight space, or a so-called proximity gap, is maintained between the substrate and the surface of the heat-treating plate 11, and in this configuration, the substrate W is heated. The top surface of the heat-treating plate 11 has a high emissivity 0.9 to 1.0 in order to heat the substrate W efficiently and highly precisely. COPYRIGHT: (C)2005,JPO&NCIPI
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