| 摘要 |
According to this invention, there is provided an exposure apparatus capable of minimizing disturbance from the connecting portions of piping systems in a wafer stage (4), dust from pipes, and electrostatic buildup on the surfaces of piping members. The exposure apparatus according to this invention is an exposure apparatus (5) which projects a pattern drawn on the surface of a master onto a substrate through a projection optical system (illumination system unit) (1) and moves both of the master and substrate or only the substrate by the stage apparatus (4) relative to the projection optical system, thereby repeatedly exposing the substrate to the pattern of the master. In the apparatus, a plurality of pipes which are connected to a movable unit of the stage apparatus and have different inner and outer diameters are jointed to each other at partial outer surfaces of the pipes and are integrated into a pipe array (20) or (21).
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