发明名称 |
Heat sink having high efficiency cooling capacity and semiconductor device comprising it |
摘要 |
A heat sink for a semiconductor device comprises a base which has a first surface on which a plurality of heat-radiating fins are arranged, and a second surface which contacts the semiconductor device directly. A heat spreader is provided on the second surface of the base so that the heat spreader does not contact the semiconductor device directly.
|
申请公布号 |
US2005006054(A1) |
申请公布日期 |
2005.01.13 |
申请号 |
US20040500464 |
申请日期 |
2004.07.14 |
申请人 |
|
发明人 |
MIYAZAKI RYUUJI;SUZUKI MASUMI |
分类号 |
H01L23/367;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/367 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|