发明名称 Production of relaxed semiconductor layer on semiconductor substrate used in production of high frequency circuits comprises roughening surface of substrate by dry etching, and forming semiconductor layer on surface
摘要 <p>Production of a relaxed semiconductor layer on a semiconductor substrate comprises preparing the substrate with a surface, roughening the surface of the substrate by dry etching to form a roughened surface, and forming the semiconductor layer on the roughened surface.</p>
申请公布号 DE10325549(A1) 申请公布日期 2005.01.13
申请号 DE2003125549 申请日期 2003.06.05
申请人 FRAUNHOFER-GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V. 发明人 HACKER, ERWIN
分类号 C30B25/02;C30B25/18;H01L21/20;H01L21/3065;H01L21/322;(IPC1-7):H01L21/20;H01L21/306 主分类号 C30B25/02
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