发明名称 COATED CONDUCTIVE PARTICLE, ANISOTROPIC CONDUCTIVE MATERIAL, AND CONDUCTIVE CONNECTION STRUCTURE
摘要 <p>Disclosed is a coated conductive particle which can be preferably used for conductively connecting electronic devices or electronic components with high connection reliability. Also disclosed are an anisotropic conductive material using the coated conductive particle and a conductive connection structure which is conductively connected using the coated conductive particle or the anisotropic conductive material. The coated conductive particle is composed of a particle having a conductive metallic surface and insulating fine particles covering the surface of the particle having a conductive metallic surface. The particle having a conductive metallic surface has a plurality of projections on the surface.</p>
申请公布号 WO2005004172(A1) 申请公布日期 2005.01.13
申请号 WO2004JP08969 申请日期 2004.06.25
申请人 SEKISUI CHEMICAL CO., LTD.;WAKIYA, TAKESHI;UENOYAMA, SHINYA;TATENO, AKIHIKO 发明人 WAKIYA, TAKESHI;UENOYAMA, SHINYA;TATENO, AKIHIKO
分类号 H01R11/01;H01B1/22;H01B5/00;H01B5/16;H01R13/24;H01R43/00;H05K3/32;(IPC1-7):H01B5/16 主分类号 H01R11/01
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