NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT, AS WELL AS METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE AND DISPLAY ELEMENT

摘要

PROBLEM TO BE SOLVED: To provide a negative photosensitive resin composition which is high sensitivity to permit aqueous alkaline solution development and does not foam despite of curing and a semiconductor device or display element using the same and a method for manufacturing the semiconductor device or the display element.

SOLUTION: The negative type photosensitive resin composition contains an alkali-soluble resin (A), a photo-acid initiator (B) and a compound having a methylol group (C), in which the alkali-soluble resin (A) is preferably a polyamide resin containing the structure expressed by a specific formula and the compound having the methylol group (C) is a compound having ≥2 methylol groups.

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