SEMICONDUCTOR CHIP, METHOD OF CONNECTING THE SAME, AND METHOD OF FORMING BUMP ELECTRODE

摘要

PROBLEM TO BE SOLVED: To provide a method of protecting a part of a semiconductor chip or a board where a high bump is connected against damage even when bumps vary in height and ensuring that the semiconductor chip or the board is kept high in electrical reliability. SOLUTION: A plurality of bumps 2 connecting a plurality of bonding pads 1a formed on the semiconductor chip 1 with a plurality of lead electrodes 3a formed on the board 3 are formed into blade springs which protrude in a direction in which they are elastically deformed. COPYRIGHT: (C)2005,JPO&NCIPI