发明名称 POWER SOURCE ADAPTER FOR SPUTTERING SYSTEM, AND CONTROL METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a power source adapter for a sputtering system with which film thickness is accurately controlled, and to provide a control method therefor. SOLUTION: The power source adapter lies between a sputtering system 2 and a power source 3 and performs the ON/OFF control in the feed of power. The adapter is provided with: a voltage AD converter for digitally converting an applied voltage value and generating voltage information; a current AD converter for digitally converting a flowing-in current value and generating current information; a power integrating means for integrating input power using the voltage information and current information each digitally outputted; a target energy setting means; a set value preserving means for preserving the set value as a threshold; a power comparing means for dividing the input power to the threshold per minute time and comparing them; and a power source controlling part 20 for performing the ON/OFF control in the feed of the power with respect to the power source 3 based on the comparison result. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005008980(A) 申请公布日期 2005.01.13
申请号 JP20030177629 申请日期 2003.06.23
申请人 RANDOMAAKU TECHNOL:KK 发明人 MATSUZAWA REIJI
分类号 C23C14/34;(IPC1-7):C23C14/34 主分类号 C23C14/34
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