| 摘要 |
PROBLEM TO BE SOLVED: To reduce the defect of a mold-releasing film caused by large rough projections and film chips without lowering the flatness of the film. SOLUTION: A mold releasing polyphenylene sulfide film at least 5 nm and below 30 nm in average roughness and at least 225 J/g in melt heating value is provided. COPYRIGHT: (C)2005,JPO&NCIPI
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