发明名称 Method of manufacturing semiconductor device and method of cleaning plasma etching apparatus used therefor
摘要 A method of manufacturing a semiconductor device according to an aspect of the present invention includes: forming a low-k dielectric film above a semiconductor substrate; forming a resist pattern above the low-k dielectric film; etching the low-k dielectric film using the resist pattern as a mask; and stripping the resist pattern by plasma processing using ammonium ions.
申请公布号 US2005009356(A1) 申请公布日期 2005.01.13
申请号 US20040843508 申请日期 2004.05.12
申请人 KOJIMA AKIHIRO;OHUCHI JUNKO;HAYASHI HISATAKA 发明人 KOJIMA AKIHIRO;OHUCHI JUNKO;HAYASHI HISATAKA
分类号 G03F7/42;H01L21/027;H01L21/3065;H01L21/768;H01L23/522;(IPC1-7):H01L21/476 主分类号 G03F7/42
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