| 发明名称 |
Semiconductor device and manufacturing method thereof |
| 摘要 |
A semiconductor device includes: a substrate having a main surface, a rear surface and four side surfaces; a semiconductor element formed on the main surface of the substrate; a notch formed in at least one bottom part of the side surfaces of the substrate; and a curved surface provided at an intersection of a side surface of the notch and the rear surface of the substrate.
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| 申请公布号 |
US2005006725(A1) |
申请公布日期 |
2005.01.13 |
| 申请号 |
US20040845232 |
申请日期 |
2004.05.14 |
| 申请人 |
KUROSAWA TETSUYA;IMORI YOSHIHISA |
发明人 |
KUROSAWA TETSUYA;IMORI YOSHIHISA |
| 分类号 |
B24B47/02;H01L21/00;H01L21/02;H01L21/301;H01L21/304;H01L21/44;H01L21/78;(IPC1-7):B24B47/02 |
主分类号 |
B24B47/02 |
| 代理机构 |
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代理人 |
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