| 摘要 |
A light emitting diode mounting structure includes a metal plate provided with a plurality of openings and at least one fixed plastic base according to requirements. The plate is also disposed with a pillar wire holder at a lower portion thereof, and a column having a recess at a center of an upper portion thereof. The recess is placed with a chip. Another pillar wire holder is provided parallel to the aforesaid wire holder, and has one end thereof penetrated through the fixed plastic base, and the penetrated end thereof is connected to the chip via a metal wire. Epoxy is filled into a mold, and the metal plate is placed into the mold for encapsulation. Or, epoxy is filled into an outer housing, and the metal plate is placed into the outer housing for forming a light emitting diode.
|
