发明名称 |
Semiconductor device package |
摘要 |
An embodiment of the present invention allows mold compound to flow underneath a substrate where the mold compound will remain in place until the process of mold formation is completed. The mold compound of the package will penetrate all available cavities where the mold compound will remain in place and harden. After hardening, the mold compound surrounding a mold anchor will support an anchored area. |
申请公布号 |
US2005006668(A1) |
申请公布日期 |
2005.01.13 |
申请号 |
US20040914870 |
申请日期 |
2004.08.09 |
申请人 |
ST ASSEMBLY TEST SERVICES LTD. |
发明人 |
ARARAO VIRGIL C.;APALE HERMES T.;SHIM IL KWON |
分类号 |
H01L21/56;H01L23/13;H01L23/31;(IPC1-7):H01L23/495 |
主分类号 |
H01L21/56 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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