| 摘要 |
<P>PROBLEM TO BE SOLVED: To solve a problem that forming work for a lead wire is required, when joining the lead wire for holding a piezoelectric vibration piece to a package, in a piezoelectric device. <P>SOLUTION: This piezoelectric device of the present invention is constituted of the piezoelectric vibration piece, the lead wire with one end connected to the piezoelectric vibration piece to hold the piezoelectric vibration piece, and a support substrate for supporting the lead wire, of which the vicinity of the other end is fixed onto a face brought into an obverse and reverse relation with respect to a face opposed to the vibration piece. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
