| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic device in which connection failure due to the warp of a semiconductor device is prevented at the time of reflowing, and to provide a printed circuit board, a print mask and a process for manufacturing an electronic apparatus. SOLUTION: A plurality of pads 22 are provided on a printed circuit board 21 at positions facing solder balls 33 of a semiconductor device 30. First cream solder 23a is printed on the plurality of pads 22 formed in the central part. Thin second cream solder 23b having a diameter smaller than that of the first cream solder 23a is printed on the pads 22 formed at the outer circumferential part. Since solder supply is reduced, adjacent solders are not connected even if the semiconductor device 30 is warped at the time of reflow heating and the outer circumferential part thereof approaches the printed circuit board. COPYRIGHT: (C)2005,JPO&NCIPI
|
