| 摘要 |
For marking a package efficiently at low cost, there is provided a dicing sheet 25 having transfer patterns 28A, 28B and an alignment mark 31 disposed at predetermined positions on a main surface of a base material 26, and an orientation flat 32 of a semiconductor wafer 1 and the alignment mark 31 are aligned with each other, then the main surface of the dicing sheet with the transfer patterns 28A, 28B and the alignment mark 31 disposed thereon and a back surface of the semiconductor wafer 1 are affixed to each other, and thereafter heat and pressure are applied to a back surface of the dicing sheet 25, thereby allowing the transfer patterns 28A and 28B to be transferred at a time to back surfaces of semiconductor chips from the dicing sheet 25.
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