| 发明名称 |
PRINTED WIRING BOARD,SEMICONDUCTOR DEVICE, AND MANUFACTURING METHOD |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed wiring board having a high dielectric layer on an organic substrate, and to provide a semiconductor device and a manufacturing method. <P>SOLUTION: The printed wiring board is manufactured by using a method for etching/removing a metal plate after a plurality of wiring boards are laminated on the metal plate. Dielectric paste is formed on an electrode arranged on the metal plate and the electrode is formed on it. Thus, a dielectric film of a high specific dielectric constant is obtained by calcinating the electrode. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
| 申请公布号 |
JP2005011882(A) |
申请公布日期 |
2005.01.13 |
| 申请号 |
JP20030172033 |
申请日期 |
2003.06.17 |
| 申请人 |
NEC TOPPAN CIRCUIT SOLUTIONS INC |
发明人 |
NAKAMURA HIROBUMI |
| 分类号 |
H05K3/46;(IPC1-7):H05K3/46 |
主分类号 |
H05K3/46 |
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