| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated ceramic electronic component where a interlayer break-away between ceramic green sheet conductive layers does not occur, sticked substance on the inside surface of holes is surely removed, and an electrical connection between a conductive layer and through-conductor of the same pole is excellent. SOLUTION: The method for manufacturing a laminated ceramic electronic component includes a following process: conductive layers 3, 4, composed of a first conductive paste containing a first binder resin whose coefficient of water absorption is 0.5% or more and solubility for water is 0.01 wt% to 1.00 wt%, is laminated between a plurality of ceramic green sheets 2 to form a laminated layer 11. Then, (a) a process where holes 15, 16 are formed in the laminate 11 along the lamination direction by exposing the conductive layers 3, 4 on the inside surface thereof and at least one end thereof is opened on the main surface of the laminate 11; and (b) a process where the sticked substance 9 on the inside surface of the holes 15, 16 is removed by immersing the laminated layer 11 ultrasonic cleaning, and by in water, and the holes 15, 16 are filled with a conductive paste 2. Then, the laminated ceramic electronic component is manufactured through a process to sinter the laminated layer and the conductive paste. COPYRIGHT: (C)2005,JPO&NCIPI
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