| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder coating method in a wiring board where excessive solder powder can securely be removed without occurrence of dust, and solder coating can be performed with good yield. SOLUTION: The solder coating method in the wiring board where a thin layer 24 is coated on the metal pad 14 of the wiring board 10 is provided with a process for forming an adhesive layer 16 on the metal pad 14 of the wiring board 10, a process for dispersing solder powder 18 on the wiring board 10 and making solder powder 18 adhere onto the metal pad 14 through the adhesive layer 16, a powder removing process for atomizing pure water onto the wiring board 10 by a spray nozzle 22 and making excessive solder powder 18 flow out, and a process for making solder powder 18 reflow and forming the solder thin layer 24 on the metal pad 14. COPYRIGHT: (C)2005,JPO&NCIPI
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