| 摘要 |
PROBLEM TO BE SOLVED: To provide a surface roughening method for copper foil with which the consumption of an anode electrode is reduced even in roughening treatment at a high current density, the roughening treatment can easily be performed at a high current density, and a fine, roughened plating film capable of corresponding to fine patterning or high frequency can be obtained. SOLUTION: In the surface roughening method for copper foil, at the time when plating is performed with copper foil 1 located on a position opposed to an anode electrode 2 as a cathode in a plating liquid 4, and a roughening treatment layer formed from a projecting electrodeposition is formed on the surface of the copper foil 1, the area of the copper foil 1 dipped into the plating liquid 4 is controlled to 1/5 to 4/5 of the area of the anode electrode 2. COPYRIGHT: (C)2005,JPO&NCIPI
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