发明名称 HALOGEN-FREE LOW-THERMAL-EXPANSION COMPOSITE LAMINATE
摘要 PROBLEM TO BE SOLVED: To provide a laminate, a halogen-free composite laminate in particular, which is obtained by using a resin composition constituted mainly of a radical polymerizable resin, which excels in toughness, heat resistance and water resistance and has such a low thermal expansion coefficient that the average linear expansion coefficient (10<SP>-6</SP>/°C) in a temperature range of 40-100°C is 20 or below, which can be worked and used at a high temperature and compares favorably in performance in place of an expensive material such as an epoxy resin used so far, and which excels also in fire retardance and can be manufactured inexpensively. SOLUTION: A halogen-free low-thermal-expansion composite laminate having all of the above features together is obtained by stacking and curing fiber-reinforced layers which are impregnated with resin compositions prepared respectively by compounding specified quantities of thermoplastic resins with a halogen-free radical polymerizable resin, a radical polymerizable monomer, a fire retardant and an inorganic filler. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005007783(A) 申请公布日期 2005.01.13
申请号 JP20030175905 申请日期 2003.06.20
申请人 JAPAN COMPOSITE CO LTD;MATSUSHITA ELECTRIC WORKS LTD 发明人 OKUMURA HIROYA;TAKEUCHI HIROSHI;HIRATA ISAO;NOZUE AKIYOSHI
分类号 C08J5/04;B32B17/04;C08K3/22;C08L85/02;C08L101/00;H05K1/03;(IPC1-7):B32B17/04 主分类号 C08J5/04
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