发明名称 Apparatus and method for formation of a wiring pattern on a substrate, and electronic devices and producing methods thereof
摘要 A wiring pattern-forming apparatus, includes a transfer plate 15 for transferring a wiring material 11 arranged to form a wiring pattern onto a substrate 10, a wiring material feeder 2 for feeding the wiring material 11 onto the transfer plate 15, and an energy feeder 6, 7 to feed energy to the wiring material 11 fed to the transfer plate 15 by the wiring material feeder 6. By utilizing the energy fed from the energy feeder 6, 7, the viscosity of the wiring material 11 when the material 11 is fed from the material feeder 2 to the transfer plate 15 is made different from that of the wiring material 11 when the material 11 is transferred from the transfer plate 15 to the substrate 10.
申请公布号 US2005009327(A1) 申请公布日期 2005.01.13
申请号 US20040844428 申请日期 2004.05.13
申请人 YOSHIDA YOSHIHIRO;SANO TAKESHI;OHKURA HIDEAKI;KOBAYASHI HIROFUMI 发明人 YOSHIDA YOSHIHIRO;SANO TAKESHI;OHKURA HIDEAKI;KOBAYASHI HIROFUMI
分类号 H01L21/4763;H01L21/48;H01L51/00;H01L51/40;H05K1/03;H05K3/20;H05K3/38;(IPC1-7):H01L21/476 主分类号 H01L21/4763
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