发明名称 APPARATUS FOR COLLECTING SCRAPS TO AUTOMATICALLY EMPTY SCRAPS FILLED IN SCRAP COLLECTING APPARATUS DURING SEMICONDUCTOR FABRICATING PROCESS
摘要 PURPOSE: An apparatus for collecting scraps is provided to automatically empty the scraps filled in a scrap collecting apparatus during a semiconductor fabricating process by opening/shutting the cover of the bottom surface of a body of the scrap collecting apparatus by an open-and-shut movement unit and by including a sensor to open/shut the cover automatically. CONSTITUTION: A box-type body(21) is prepared whose lower part is open. An inducing pipe(26) for inducing scraps is formed in the upper part of the box-type body. The inside of the box-type body is sealed to pile up the scraps, The inside of the box-type body is opened by a bottom surface cover(23) of the box-type body to make the piled scraps fall free. An open-and-shut movement unit performs an open-and-shut operation on the bottom surface cover with respect to the box-type body, coupled to the bottom surface cover.
申请公布号 KR20050005273(A) 申请公布日期 2005.01.13
申请号 KR20030044297 申请日期 2003.07.01
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KO, TAE RYONG
分类号 H01L21/02;(IPC1-7):H01L21/02 主分类号 H01L21/02
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