发明名称 |
APPARATUS FOR COLLECTING SCRAPS TO AUTOMATICALLY EMPTY SCRAPS FILLED IN SCRAP COLLECTING APPARATUS DURING SEMICONDUCTOR FABRICATING PROCESS |
摘要 |
PURPOSE: An apparatus for collecting scraps is provided to automatically empty the scraps filled in a scrap collecting apparatus during a semiconductor fabricating process by opening/shutting the cover of the bottom surface of a body of the scrap collecting apparatus by an open-and-shut movement unit and by including a sensor to open/shut the cover automatically. CONSTITUTION: A box-type body(21) is prepared whose lower part is open. An inducing pipe(26) for inducing scraps is formed in the upper part of the box-type body. The inside of the box-type body is sealed to pile up the scraps, The inside of the box-type body is opened by a bottom surface cover(23) of the box-type body to make the piled scraps fall free. An open-and-shut movement unit performs an open-and-shut operation on the bottom surface cover with respect to the box-type body, coupled to the bottom surface cover.
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申请公布号 |
KR20050005273(A) |
申请公布日期 |
2005.01.13 |
申请号 |
KR20030044297 |
申请日期 |
2003.07.01 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
KO, TAE RYONG |
分类号 |
H01L21/02;(IPC1-7):H01L21/02 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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