发明名称 METHOD FOR SIMULATING HEAT SEALING CONDITION
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for operationally making the temperature data of a welding surface of all of start temperature and arrival temperature conditions of a simulation range using one sampled data. <P>SOLUTION: The proper setting of a heating temperature and a pressure bonding time due to a heating element in heat sealing operation is performed according to a process (1) for inserting a microsensor in the welding surface of the small piece of a material to be heated in a laboratory to sample the response data (sample data) of the temperature of the welding surface at a heating temperature in the vicinity of a temperature higher than the melting temperature of heat sealing set temperature range by 10-20&deg;C by a melting surface temperature measuring method, a process (2) for preserving the sampled response data as a digital signal to move the same to a personal computer and a process (3) for reading a start temperature (T<SB>L1</SB>) and an arrival temperature (T<SB>H1</SB>) (T<SB>H1</SB>-T<SB>L1</SB>=&Delta;T<SB>1</SB>) from the sample data to determine an arbitrary start temperature (T<SB>Ln</SB>) and an arbitrary arrival temperature (T<SB>Hn</SB>) as (T<SB>Hn</SB>-T<SB>Ln</SB>=&Delta;T<SB>n</SB>) and multiplying the individual data of the sample data by [&Delta;T<SB>n</SB>/&Delta;T<SB>1</SB>] before adding [T<SB>Ln</SB>-T<SB>L1</SB>&times;(&Delta;T<SB>n</SB>/&Delta;T<SB>1</SB>)] thereto to obtain simulation data. <P>COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005007845(A) 申请公布日期 2005.01.13
申请号 JP20030201369 申请日期 2003.06.20
申请人 HISHINUMA KAZUO 发明人 HISHINUMA KAZUO
分类号 B65B51/10;B29C65/20 主分类号 B65B51/10
代理机构 代理人
主权项
地址