Lateral contacting method for semiconductor chip, by applying adhesive layer, pressing on particle of thermally fusible material, applying semiconductor chip and heating

摘要

The method involves applying an adhesive layer (27) to a contact surface, pressing a preformed particle (23) made of electrically conductive, thermally meltable material onto the layer (27), and applying a semiconductor chip (11). The semiconductor chip and particle are heated until the particle melts onto the electrical contacts (17,18) of two semiconductor chips.