| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide an IC card having a built-in power storage element whose thickness restriction is alleviated. <P>SOLUTION: In the IC card 10, even if the positions of end faces 34a, 34b of the power storage element 22 entering in openings 38c, 40c formed on top surface layers 14c, 16c change, the thickness D2 of the IC card 10 does not change. That means, if the thickness D1 of the power storage element 22 is increased, the sides of end faces 34a, 34b become nearer to the surfaces 10a, 10b of the IC card 10, but the thickness of the IC card 10 is held constant. Accordingly, in the IC card 10, the thickness D1 of the power storage element 22 can be increased up to the thickness when the end faces 34a, 34b of the power storage element 22 reach the surfaces 10a, 10b of the IC card 10, so that the alleviation of the thickness restriction for the built-in power storage element 22 is realized. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
