| 摘要 |
PROBLEM TO BE SOLVED: To shorten the wiring length in a semiconductor device of a folded structure used for various electric equipment. SOLUTION: In the semiconductor device, circuit blocks (13a, 13b, 13c and 13d) are two-dimensionally arranged on one plastic film 11 in the form of an array. The plastic film 11 is folded with a folding line 17a of a column direction and a folding line 17b of a row direction, and the semiconductor in which the circuit block 13 is mounted in a high density is completed. Since the circuit block 13 before folding is arranged in both vertical and horizontal directions, wiring between the circuit blocks 13 of the column direction and the row direction can be shortened and simplified. COPYRIGHT: (C)2005,JPO&NCIPI |
