发明名称 |
TAPE CUTTING AND CONTACT BONDING DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a tape cutting and contact bonding device having a tape feeding mechanism without clogging a mold or the inside of a tape guide with the tape. SOLUTION: The tape cutting and contact bonding device is provided with the tape feeding mechanism constituted of a tape guide (7) in which the tape (6) can run, a fixing clamp (8) fixed to the tape guide (7) and alternately holding and releasing the tape (6) in the tape guide (7); a tape feeding mechanism composed of a moving clamp (9) capable of stopping at least in three positions away in the feeding direction of the tape (6), movable among each position, and alternately holding and releasing the tape (6) in the tape guide (7); and a mold for cutting the tape (6) fed by a predetermined amount of the tape feeding. COPYRIGHT: (C)2005,JPO&NCIPI |
申请公布号 |
JP2005011985(A) |
申请公布日期 |
2005.01.13 |
申请号 |
JP20030174389 |
申请日期 |
2003.06.19 |
申请人 |
SUMITOMO METAL MINING CO LTD |
发明人 |
TOGASHI MASAMICHI;SATO FUMIO;AKUTSU SATOSHI;UCHINO YASUYOSHI;KATOU TAKEHIRO |
分类号 |
H01L21/50;H01L23/50;(IPC1-7):H01L23/50 |
主分类号 |
H01L21/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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