| 摘要 |
PROBLEM TO BE SOLVED: To provide a highly reliable area array type semiconductor device capable of preventing teardown inside a resin, since the separation between a mold sealing resin and an interposer substrate will not be caused even when a heat shock is applied thereon. SOLUTION: Grooves 16 or protrusions provide a bonding surface between the interposer substrate 7 and a mold sealing resin 5, provided so as to cover semiconductor chips 1, 12, with a recessed and projected configuration, and are formed on the interposer substrate 7 for mounting the semiconductor chips 1, 12. According to this method, a bonding area between the interposer substrate 7 and the mold sealing resin 5 is increased, whereby resistance against a stress in a direction along the surface of the substrate and an unplug stress in the thickness direction of the substrate can be increased. COPYRIGHT: (C)2005,JPO&NCIPI
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