发明名称 FILM FORMING DEVICE, METHOD OF CLEANING FILM FORMING DEVICE, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To improve the wraparound property of a cleaning gas while the dilution of the cleaning gas is made possible. SOLUTION: At the time of cleaning a film forming device, the cleaning gas G4 is introduced into an inner tube 2 through a cleaning gas introducing pipe 7d, and the flows of a gas introduced into an inert gas introducing pipe 7a and another gas introduced into an impurity supplying gas introducing pipe 7c are interrupted by respectively closing valves Va and Vc. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2005011832(A) 申请公布日期 2005.01.13
申请号 JP20030170701 申请日期 2003.06.16
申请人 SEIKO EPSON CORP 发明人 NARISAWA SHIN
分类号 C23C16/44;H01L21/205;H01L21/3065;(IPC1-7):H01L21/205;H01L21/306 主分类号 C23C16/44
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