FILM CARRIER TAPE FOR MOUNTING ELECTRONIC COMPONENT, ITS MANUFACTURING METHOD, AND SCREEN FOR APPLYING SOLDER RESIST

摘要

PROBLEM TO BE SOLVED: To provide a film carrier tape for mounting an electronic component that is reduced in the occurrence of defective connection. SOLUTION: In this film carrier tape for mounting electronic component, a wiring pattern is formed on the surface of an insulating film and, in addition, a solder resist layer is formed on the surface of the insulating film except the portions of the connecting terminals of the wiring pattern. The applied thickness of a solder resist in the edge of the solder resist layer continuously decreases. Consequently, a stable electrical junction can be obtained even when a positional deviation occurs in the film carrier tape to some degree. COPYRIGHT: (C)2005,JPO&NCIPI