发明名称 |
Surface mount multichip devices |
摘要 |
A surface-mountable multi-chip device is provided which includes first and second lead frame portions and at least two chips. The lead frame portions each include a header region and a lead region. Beneficially, the header regions of the first and second lead frame portions lie in a common plane, with at least one semiconductor chip being placed on each of the header regions. A conductive member link is placed on top of the two chips to electrically and mechanically interconnect the chips.
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申请公布号 |
US2005006731(A1) |
申请公布日期 |
2005.01.13 |
申请号 |
US20030617343 |
申请日期 |
2003.07.10 |
申请人 |
GENERAL SEMICONDUCTOR, INC. |
发明人 |
O'SHEA PADDY;MEDLEY EAMONN;O'DONOGHUE FINBARR;HORSMAN GARY |
分类号 |
H01L23/495;(IPC1-7):H01L21/48 |
主分类号 |
H01L23/495 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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