SYSTEM AND METHOD FOR SHARING INFORMATION OF PATTERN THICKNESS OF SEMICONDUCTOR DEVICE TO SIMPLIFY PROCESS FOR MEASURING THICKNESS OF OBJECT TO BE POLISHED

摘要

PURPOSE: A system for sharing information of a pattern thickness of a semiconductor device is provided to simplify a process for measuring the thickness of an object to be polished in a CMP(chemical mechanical polishing) process in which a material layer pattern formed on a semiconductor substrate is used as the object to be polished. CONSTITUTION: While deposition equipment(121), CMP equipment(123) and measuring equipment(122) have a predetermined communication relationship, the thickness information measured by the measuring equipment is classified with respect to a pattern formed by a deposition process in the deposition equipment to be selectively stored in a corresponding region of a pattern thickness information DB(database)(110). The pattern thickness information is selectively stored/outputted in/to a required region of the pattern thickness information DB by a DB control module(102). A pattern thickness information control module(101) and the DB control module have a predetermined communication relationship. The pattern thickness information control module selectively stores the pattern thickness information measured by the measuring equipment in the pattern thickness information DB by using the DB control module as a medium or extracts stored pattern thickness information to deliver the pattern thickness information to the CMP equipment.