| 摘要 |
There are provided a polishing method and a polishing apparatus for appropriately controlling the potential of an acting electrode to perform an accurate and stable electrolytic polishing process. There is also provided a method of manufacturing a semiconductor device using the polishing method and the polishing apparatus. In the polishing method according to the present invention, a substrate with a metal film formed thereon and a counter electrode are disposed in facing relation to each other in an electrolytic liquid, and a current is supplied to the metal film through the electrolytic liquid based on the potential of the metal film with respect to a reference electrode. The polishing apparatus according to the present invention has, disposed in an electrolytic liquid, a substrate with a metal film formed thereon, a counter electrode disposed in facing relation to the substrate with a predetermined gap therebetween, and a reference electrode for providing a reference potential for the metal film, wherein a current is supplied to the metal film through the electrolytic liquid based on the potential of the metal film with respect to the reference electrode.
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