| 摘要 |
PURPOSE: Provided is a high insulation resin composition for protective film, which is used as packaging materials for high added-value electronic products and semiconductors due to excellent electrical insulation property. CONSTITUTION: The high insulation resin composition for protective film comprises a low-density polyethylene(LDPE) resin or ethylene vinyl acetate(EVA) resin as a base resin and an alpha-olefin copolymer(alpha-OL) resin. In the resin composition, the mixing ratio of the base resin to alpha-olefin copolymer resin is 1:99-99:1 on the weight basis. Particularly, the LDPE resin has a melt index of 2-30 g/10 min and a density of 0.80-0.95 g/cm¬3, and the alpha-OL resin has a melt index of 2-30 g/10 min. In a variant, the EVA resin has a vinyl acetate content of 2-50 wt% and a melt index of 7-100 g/10 min, and the alpha-OL resin has a melt index of 2-100 g/10 min.
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